Tower Semiconductor Announces a New RF Switch Technology with Breakthrough Performance
03 August 2020 - 8:00PM
Enables cutting-edge solutions for 5G and
high-performance RF switch markets
with record Figure of Merit performance: Ron
x Coff less than 10 femtoseconds
The new technology will be presented at
IMS 2020, with MPWs available in 2021
MIGDAL HAEMEK, Israel,
August 03, 2020 –Tower Semiconductor (NASDAQ/TASE:
TSEM), the leader in high-value analog semiconductor foundry
solutions, today announces a new radio frequency (RF) switch
technology with record figure of merit targeting the 5G and
high-performance RF switch markets. This new switch technology
enables more efficient, novel RF system architectures in
applications including mobile, base-station and mmWave
communications. Tower Semiconductor is engaged with multiple
customers and partners to bring this technology to market for
next-generation products.
This new switch technology demonstrates a record
RF device figure of merit: Ron x Coff < 10 femtoseconds vs.
70-100 femtoseconds in use today for the most advanced
applications. The switch performs over an extremely wide range of
frequencies spanning MHz to all frequency bands discussed for 5G,
and further into the mmWave. This results in extremely low
insertion loss and very small device size.
The switch is also nonvolatile so consumes no
energy when in the on-state or off-state, making it attractive for
IoT, and other power and battery sensitive product applications.
Finally, Tower has demonstrated the versatility of this patented
technology by integrating it with some of its other process
platforms such as SiGe BiCMOS and Power CMOS.
Tower Semiconductor will be offering
multi-project wafer runs (MPWs) in 2021 for select customers.
The new RF switch will be presented at IMS 2020
(International Microwave Symposium) with results from electrical
devices, process integration and circuits fabricated at Tower
Semiconductor. Presentations are part of the Tu1G:
Innovative RF Switches and Applications session (Tu1G-2
and Tu1G-5).
The Live Stream event will take place Aug. 4 –
6, 2020. For more details about the presentations, please visit IMS
2020 event website here.
For more information about Tower Semiconductor’s
RF & HPA process technology offerings, please click here.
For more information about Tower Semiconductor’s
process technology offerings, please click here.
About Tower Semiconductor
Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE:
TSEM), the leader in high-value analog semiconductor foundry
solutions, provides technology and manufacturing platforms for
integrated circuits (ICs) in growing markets such as consumer,
industrial, automotive, mobile, infrastructure, medical and
aerospace and defense. Tower Semiconductor focuses on creating
positive and sustainable impact on the world through long term
partnerships and its advanced and innovative analog technology
offering, comprised of a broad range of customizable process
platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS
image sensor, non-imaging sensors, integrated power management (BCD
and 700V), and MEMS. Tower Semiconductor also provides world-class
design enablement for a quick and accurate design cycle as well as
Transfer Optimization and development Process Services (TOPS) to
IDMs and fabless companies. To provide multi-fab sourcing and
extended capacity for its customers, Tower Semiconductor operates
two manufacturing facilities in Israel (150mm and 200mm), two in
the U.S. (200mm) and three facilities in Japan (two 200mm and one
300mm) through TPSCo. For more information, please visit
www.towersemi.com.
Safe Harbor Regarding Forward-Looking
StatementsThis press release includes forward-looking
statements, which are subject to risks and uncertainties. Actual
results may vary from those projected or implied by such
forward-looking statements. A complete discussion of risks and
uncertainties that may affect the accuracy of forward-looking
statements included in this press release or which may otherwise
affect TowerJazz’s business is included under the heading "Risk
Factors" in Tower’s most recent filings on Forms 20-F, F-3, F-4 and
6-K, as were filed with the Securities and Exchange Commission (the
“SEC”) and the Israel Securities Authority and Jazz’s most recent
filings on Forms 10-K and 10-Q, as were filed with the SEC,
respectively. Tower and Jazz do not intend to update, and expressly
disclaim any obligation to update, the information contained in
this release.
###
Tower Semiconductor Company
Contact: Orit Shahar | +972-74-7377440 |
oritsha@towersemi.comTower Semiconductor Investor
Relations Contact:
Noit Levy | +972-4-604-7066 |
noitle@towersemi.com
- PCM_Switch_PR_Final_080320
- Tower Announces a New RF Switch Technology
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