Completely Upgraded Servers with the New
Intel® Xeon® 6900
Series Processors with P-Cores Optimized for Maximum Performance
are Now Shipping in Volume, Featuring Next-Generation GPU Support,
Higher-Bandwidth Memory, 400GbE Networking, E1.S and E3.S Drives,
and the Industry's Leading Direct-to-Chip Liquid Cooling
Solutions
SAN
JOSE, Calif., Jan. 9, 2025
/PRNewswire/ -- Supermicro, Inc. (NASDAQ: SMCI) a Total IT
Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge is
commencing shipments of max-performance servers featuring Intel
Xeon 6900 series processors with P-cores. The new systems feature a
range of new and upgraded technologies with new architectures
optimized for the most demanding high-performance workloads
including large-scale AI, cluster-scale HPC, and environments where
a maximum number of GPUs are needed, such as collaborative design
and media distribution.
"The systems now shipping in volume promise to unlock new
capabilities and levels of performance for our customers around the
world, featuring low latency, maximum I/O expansion providing high
throughput with 256 performance cores per system, 12 memory
channels per CPU with MRDIMM support, and high performance EDSFF
storage options," said Charles
Liang, president and CEO of Supermicro. "We are able to ship
our complete range of servers with these new application-optimized
technologies thanks to our Server Building Block
Solutions® design methodology. With our global capacity
to ship solutions at any scale, and in-house developed liquid
cooling solutions providing unrivaled cooling efficiency,
Supermicro is leading the industry into a new era of maximum
performance computing."
Click here for more information.
There are currently several X14 systems available to customers
for remote testing and validation via Supermicro's JumpStart
program.
The Supermicro X14 systems are available in a variety of form
factors, each optimized for a range of performance-intensive
workloads:
- GPU-optimized supporting the latest generation of SXM and PCIe
GPUs, featuring enhanced thermal capacities and direct-to-chip
liquid cooling on some models.
- High density multi-nodes including all-new FlexTwin™ and
GrandTwin® models as well as the proven, award-winning
SuperBlade® architecture.
These models leverage shared components to increase efficiency
and can be fitted with direct-to-chip liquid cooling for maximum
performance density.
- Market-proven Supermicro Hyper rackmounts combine single or
dual socket architectures with flexible I/O and storage
configurations in traditional rackmount form factors to help
enterprises and data centers scale up and out as their workloads
evolve.
Supermicro's max-performance X14 systems support the Intel Xeon
6900 series processors with P-cores, which feature up to 128
performance cores per CPU, support for high bandwidth MRDIMMs up to
8800 MT/s, and built-in accelerators including the AI-specific
Intel AMX.
The X14 systems represent the perfect building blocks for data
centers at any scale, with Supermicro able to provide complete
rack-level integration services including design, building,
testing, validation, and delivery. An industry-leading global
manufacturing capacity of up to 5,000 racks per month (2,000 liquid
cooled) and extensive testing and burn-in facilities allow
Supermicro to deliver solutions at any scale in a matter of weeks,
not months. With Supermicro's complete in-house liquid-cooled
direct-to-chip cold plate solutions, liquid cooling can be easily
included in rack-level integrations to further increase system
efficiency, reduce instances of thermal throttling, and lower both
the TCO and Total Cost to Environment (TCE) of data center
deployments. These turn-key solutions include the rack, cabling,
power, and cooling infrastructure to simplify solution deployment
at scale.
To maximize the performance and density potential of the latest
X14 systems, Supermicro also offers complete in-house developed
liquid cooling solutions including cold plates for CPUs, GPUs,
memory, Cooling Distribution Units, Cooling Distribution Manifolds,
hoses, connectors, and cooling towers. Liquid cooling is easily
included in rack-level integrations to increase system efficiency,
reduce instances of thermal throttling, and lowers both the TCO and
Total Cost to the Environment (TCE) of data center deployments.
Supermicro max-performance X14 systems featuring Intel Xeon 6900
series processors with P-cores include:
GPU-optimized – The highest performance Supermicro
X14 systems designed for large-scale AI training, large language
models (LLMs), generative AI and HPC, and supporting eight of the
latest-generation SXM5 and SXM6 GPUs. These systems are available
in air-cooled or liquid-cooled configurations.
PCIe GPU – Designed for maximum GPU flexibility,
supporting up to 10 double-width PCIe 5.0 accelerator cards in a
thermally-optimized 5U chassis or edge-optimized 3U chassis. These
servers are ideal for AI inferencing, media, collaborative design,
simulation, cloud gaming, and virtualization workloads.
Intel® Gaudi® 3 AI
Accelerators – Supermicro is now shipping the industry's
first AI server based on the Intel Gaudi 3 accelerator hosted by
Intel Xeon 6 processors. Designed to increase the efficiency and
lower the cost of large-scale AI model training and AI inferencing,
the system features eight Intel Gaudi 3 accelerators on an OAM
universal baseboard, six integrated OSFP ports for cost-effective
scale-out networking, and an open platform designed to use a
community-based, open-source software stack, requiring no software
licensing costs.
SuperBlade® – Supermicro's X14 6U
high-performance, density-optimized, and energy-efficient
SuperBlade maximizes rack density, with up to 100 servers and 200
GPUs per rack. Optimized for AI, HPC, and other compute-intensive
workloads, each node features air cooling or direct-to-chip liquid
cooling to maximize efficiency and achieve the lowest PUE with the
best TCO, as well as connectivity up to four integrated Ethernet
switches with 100G uplinks and front I/O supporting a range of
flexible networking options up to 400G InfiniBand or 400G Ethernet
per node.
FlexTwin™ – The new Supermicro X14 FlexTwin architecture
is purpose-built for HPC, cost-efficient, and designed to provide
maximum compute power and density in a multi-node configuration
with up to 24,576 performance cores in a 48U rack. Optimized for
HPC and other compute-intensive workloads, each node features
direct-to-chip liquid cooling only to maximize efficiency and
reduce instances of CPU thermal throttling, as well as HPC low
latency front and rear I/O supporting a range of flexible
networking options up to 400G per node.
Hyper – X14 Hyper is Supermicro's flagship rackmount
platform designed to deliver the highest performance for demanding
AI, HPC, and enterprise applications, with single or dual socket
configurations supporting double-width PCIe GPUs for maximum
workload acceleration. Both air cooling and direct-to-chip liquid
cooling models are available to facilitate the support of top-bin
CPUs without thermal limitations and reduce data center cooling
costs while also increasing efficiency.
About Super Micro Computer, Inc.
Supermicro (NASDAQ: SMCI) is a global leader in
Application-Optimized Total IT Solutions. Founded and operating in
San Jose, California, Supermicro
is committed to delivering first to market innovation for
Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are
a Total IT Solutions provider with server, AI, storage, IoT, switch
systems, software, and support services. Supermicro's motherboard,
power, and chassis design expertise further enables our development
and production, enabling next generation innovation from cloud to
edge for our global customers. Our products are designed and
manufactured in-house (in the US, Taiwan, and the
Netherlands), leveraging global operations for scale and
efficiency and optimized to improve TCO and reduce environmental
impact (Green Computing). The award-winning portfolio of Server
Building Block Solutions® allows customers to optimize for their
exact workload and application by selecting from a broad family of
systems built from our flexible and reusable building blocks that
support a comprehensive set of form factors, processors, memory,
GPUs, storage, networking, power, and cooling solutions
(air-conditioned, free air cooling or liquid
cooling).
Supermicro, Server Building Block Solutions, and We Keep IT
Green are trademarks and/or registered trademarks of Super Micro
Computer, Inc.
All other brands, names, and trademarks are the property of
their respective owners.
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SOURCE Super Micro Computer, Inc.
