ACM Research Introduces New Tools for Advanced Metal Plating
19 March 2019 - 7:30AM
ACM Research, Inc. (“ACM” or the “Company”) (NASDAQ:ACMR), a
provider of single-wafer wet cleaning equipment used by
manufacturers of advanced semiconductors, today announced two new
semiconductor electro-plating tools at SEMICON China.
ACM’s Ultra ECP AP, or “Advanced Wafer Level Packaging,” is a
back-end assembly tool used for bumping, or applying copper, tin
and nickel to semiconductor wafers at the die level prior to
packaging. The Ultra ECP AP delivers better plating
performance in the form of a more uniform metal layer at the notch
area by using ACM’s proprietary technology. This advanced
technology solution delivers better yields, greater plating
efficiency and higher throughput during the fabrication process.
ACM’s solution can also support a wide range of packaging
solutions, such as Cu pillar, solder bump, RDL, fan-out
application, TSV and gold bump.
ACM’s Ultra ECP MAP, or “Multi Anode Partial Plating,” is used
in front-end wafer fabrication processes. The tool utilizes
proprietary ACM technology to deliver world-class electrochemical
copper plating for copper interconnect applications. The ECP
MAP offers improved gap filling performance for plating on an
ultra-thin seed layer, which is critical for advanced nodes at 14,
12 nm and beyond.
ACM’s President and Chief Executive Officer Dr. David Wang
commented, "These new ECP tools demonstrate our continued
commitment to technology leadership by delivering innovative,
proprietary high-performance products beyond our single-wafer wet
cleaning solutions. The advanced semiconductor plating market
represents a good growth opportunity for us. We believe we
are well-positioned to capitalize on the opportunity, as our ECP
tools deliver significant benefits to our customers, including
greater performance, increased flexibility, and improved cycle
times."
ACM also announced today that it has received purchase orders
for two Ultra ECP AP tools from one of its major packaging
customers, and a first tool purchase order for its Ultra ECP MAP
tool from a key foundry customer. The Company expects to
deliver these tools to the respective customers in the coming
months.
Forward-Looking Statements
Information presented in this press release with respect to
ACM’s expected delivery of tools and their performance
characteristics are forward-looking statements for purposes of the
safe harbor provisions of the Private Securities Litigation Reform
Act of 1995. ACM’s actual results with respect to the timing of the
tool deliveries may vary significantly from ACM Research’s
expectations based on a number of risks and uncertainties,
including unanticipated delays in the production process, ACM
cannot guarantee any future results, levels of activity,
performance or achievements. ACM expressly disclaims any obligation
to update forward-looking statements after the date of this press
release.
About ACM Research, Inc.
ACM Research develops, manufactures and sells single-wafer
wet cleaning equipment, which semiconductor manufacturers can use
in numerous manufacturing steps to remove particles, contaminants
and other random defects, and thereby improve product yield, in
fabricating advanced integrated circuits.
© ACM Research, Inc. The ACM Research logo is a trademark
of ACM Research, Inc. All rights reserved. Any other trademarks are
the property of their respective owners.
For investor and media inquiries, please
contact:
In the United
States:
The Blueshirt GroupRalph Fong+1 (415)
489-2195ralph@blueshirtgroup.com
In
China:
The Blueshirt Group AsiaGary Dvorchak, CFA+86 (138)
1079-1480gary@blueshirtgroup.com
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